Provide consultation services to multidisciplinary teams, lead engineers, and managers through formal and informal interfaces, technical/ business reports and presentations.
Expertise in innovation and manufacturing process and principles, for new packaging introduction in high reliability manufacturing environments. Specialist in new process development and continuous improvement of existing process with innovative solutions for cost reduction, quality and reliability improvement. Managing all phases of packaging process development from concept to high volume manufacturing with first pass success. Deep expertise in determining root-cause and corrective action to prevent recurrence of field failures. Collaborate with the designers on the design for test, manufacturability and reliability for product architectures varying from highly efficient DMOS drivers to MOSFET power and MEMS packaging from building prototypes, defining process flow/ BOM debugging and testing of final assemblies. Consistently applied advanced research techniques and specialized mechanical knowledge to provide engineering and technical solutions.
We are working with OSAT partners in China and SEA.
- Package design and simulation
- Assembly and Test turnkey management services from prototype to mass production
- Back end IC Assembly line set up and qualification